Die Bonding Systems

The system is specially designed and configured for advanced packaging solutions required for semiconductor packaging, life and health sciences, aerospace, defense, automotive, and communications applications.
The MRSI-605 Assembly Work Cell sets the standard for ultra-precise, high-speed component assembly. Offering advanced vision and fully automatic operation, the system is specially designed and configured for advanced packaging solutions required for semiconductor packaging, life and health sciences, aerospace, defense, automotive, and communications applications.