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Semiconductor Process
Etching

Plasma and Xenon Difluoride etching systems
Lithography

E-beam and laser lithography systems for a wide range of applications
Plasma process

Plasma Cleaning and Photoresist Strip / Descum systems.
 
PVD/CVD Process

Physical vapour deposition based upon DC, RF magnetron sputtering and most advanced reactive bipolar & unipolar technologies.
Rapid Thermal Processing

Rapid thermal annealing process from small pieces of wafers up to 8-inch diameter
Wet Processing

Laboratory and automated production equipment for the wet processing of wafers/substrates
 
Atomic Layer Deposition

The main advantage of our products is the ability to produce extremely uniform high quality thin films with short cycle times and good repeatability.
Probe stations

Probe stations for microwave probing, low current (femtoamp) probing, thermal probing, design/debug, failure analysis and product engineering
Optical Fault Localization

Scanning optical microscopes used for fault localization of integrated circuits using laser induced phenomena

 
Dry Process Dicing

Dry Process Dicing leverages the capabilities of a fine-tuned process, a durable machine with an automated Windows NT interface, and precision diamond scribe tools.
Die Bonding Systems

The system is specially designed and configured for advanced packaging solutions required for semiconductor packaging, life and health sciences, aerospace, defense, automotive, and communications applications.

Dispensers

System provide unparalleled process control and dispense capability as demanded for applications such as microwave modules, optical modules, hybrid circuits, multichip modules, and semiconductor packaging.
 
Wire bonders

Latest development of wedge bonding innovation, responding to all wire bonding challenges on a single platform for a variety of applications such as RF and microwave devices, COB, MCM and hybrids, fibre-optics and automotive using aluminium wire, gold wire or ribbon.
 
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