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 Nanotechnology applications







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FIB UPGRADE – Hyper FIB

 

the fastest material removal rates ever possible with up to 7000nA of beam current, dramatically reducing cross-section time, increasing tool utilization and device throughput, with clean cross-sectioning of features not possible with other ion milling methods.  HyperFIB also allows full die delayering to help you answer critical questions relating to device design, piracy, counterfeiting, IP and patent infringement, and electrical failure analysis.



>300X faster than a Ga liquid-metal FIB tool and 20X more precise than laser machining.  Only with the Applied BeamsHyperFIB Upgrade.






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*Large Area IR Micro lens Arrays of Chalcogenide Glass Photoresists by Grayscale Maskless Lithography.

* Investigation of the maskless lithography technique for the rapid and cost-effective prototyping of 
  microfluidic devices in laboratories.

* Biomimetic Wet Adhesion of Viscoelastic Liquid Films Anchored on Micropatterned Elastic
  Su One-step maskless grayscale lithography for the fabrication of 3-dimensional structures in SU8
* Known for its nano-motion stages for biomedical, semiconductor and photovoltaic applications, ALIO
   Industries depends on Renishaw encoders for the accuracy and repeatability needed to drive its True 
   Nano™ motion system solutions.

* LOW-COST MASKLESS GRAYSCALE LITHOGRAPHY USING A NEW PHOTODEFINABLE POLYIMIDE FOR
   POLYMER MEMS APPLICATIONS






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Gentle Mill for preparing high performance FIB-STEM/TEM samples 

 

Technoorg’s Gentle Mill is offered for cleaning and final polishing of FIB samples. With its low-angle, lowenergy broad Ar+ ion beam it is suitable for removing the damaged layers created by the FIB during lamellae formation and also for further reducing the specimen thickness.

The Gentle Mill is provided with a dedicated low-energy ion gun down to 150eV ion energy (patented) and which allows finishing of silicon FIB samples in about 10 minutes for each side. 


ION BEAM SLOPE CUTTING

To produce planar cross-sections of different quality of solid state materials for SEM imaging and microanalysis.







Cross-sectional specimen of Zn coated steel prepared by ion beam slope cutting process cut into the near surface layer of the bulk sample

FINAL POLISHING


Inverse Pole Figure (IPF)
of the same copper sample

To produce samples for Electron Back S

Diffraction (EBSD) study and Orientation

          Imaging Microscopy (OIM)





EBSD pattern of copper sample




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Compact high-performance isolators for small to mid-size applications
i4 series
Nano Series

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Modular active isolation elements for flexible use and a variety of loads



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Vibration isolation of heavy equipment weighing more than 600 kg (1.320 lbs)
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